PVD Equipment for R&D EB1000
The EB1000 is PVD equipment for R&D with enhanced functions to support simultaneous 3-source sputtering and high temperature heating of substrates while reducing the required space. It is equipped with load lock chamber(option) and provides automated pumping operation as standard to support R&D applications in a variety of fields.
Information
R&D
- Fully automated vacuum pump operation (Touch screen operation)
- Equipped with three φ2" compact cathodes
- Simultaneous 3-source sputtering (Option)
- Support for various substrate size (≤ φ100mm) and deposition methods (offset self-rotational deposition, static facing deposition) by tray transport
- Space saving achieved by compact design
- System configuration:Tray transport method (Load lock is option)
- Substrate size:φ150mm maximum (With load lock; greatest φ100mm)
- Cathode:φ2" cathode ×3
- Operation method:Auto pumping operation, manual transport/deposit operation
- Footprint:W1800mm×D1100mm×H1550mm (standard specification)